Chiplet-Based Design and Heterogeneous Integration Fundamentals from Tonex, Inc.

Chiplet-Based Design and Heterogeneous Integration Fundamentals

Online, Self-Paced

Explore advanced semiconductor packaging with "Chiplet-Based Design and Heterogeneous Integration Fundamentals." Learn how chiplet-based architectures enhance modularity, performance, and power efficiency.

Learning Objectives

Understand chiplet-based architecture in semiconductor design

Explore heterogeneous integration techniques for advanced chips

Optimize multi-die interconnects for high-performance computing

Leverage AI for chiplet packaging and verification

Analyze industry trends in modular semiconductor design

Framework Connections

Design and Development

The materials within this course focus on the NICE Framework Task, Knowledge, and Skill statements identified within the indicated NICE Framework component(s):

Competency Areas

Work Roles

Feedback

If you would like to provide feedback on this course, please e-mail the NICCS team at NICCS@mail.cisa.dhs.gov. Please keep in mind that NICCS does not own this course or accept payment for course entry. If you have questions related to the details of this course, such as cost, prerequisites, how to register, etc., please contact the course training provider directly. You can find course training provider contact information by following the link that says “Visit course page for more information...” on this page.