Advanced Packaging and Co-Design Methodologies Masterclass from Tonex, Inc.

Advanced Packaging and Co-Design Methodologies Masterclass

Online, Self-Paced

Explore advanced semiconductor packaging techniques with "Advanced Packaging and Co-Design Methodologies Masterclass." Learn how co-design methodologies improve integration, thermal management, and performance.

Learning Objectives

Understand the fundamentals of advanced semiconductor packaging

Explore co-design methodologies for integrated circuits

Optimize packaging performance with innovative materials

Implement AI-driven solutions in chip packaging design

Analyze industry case studies on advanced packaging techniques

Framework Connections

Design and Development

The materials within this course focus on the NICE Framework Task, Knowledge, and Skill statements identified within the indicated NICE Framework component(s):

Competency Areas

Work Roles

Feedback

If you would like to provide feedback on this course, please e-mail the NICCS team at NICCS@mail.cisa.dhs.gov. Please keep in mind that NICCS does not own this course or accept payment for course entry. If you have questions related to the details of this course, such as cost, prerequisites, how to register, etc., please contact the course training provider directly. You can find course training provider contact information by following the link that says “Visit course page for more information...” on this page.