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  4. Advanced Packaging and Co-Design Methodologies Masterclass

Advanced Packaging and Co-Design Methodologies Masterclass

Explore advanced semiconductor packaging techniques with "Advanced Packaging and Co-Design Methodologies Masterclass." Learn how co-design methodologies improve integration, thermal management, and performance.

Course Overview

Overall Proficiency Level
2 - Intermediate
Course Catalog Number
T101
Course Prerequisites

None

Training Purpose
Functional Development
Management Development
Specific Audience
All
Delivery Method
Online, Self-Paced
  • Online, Self-Paced

Learning Objectives

  • Understand the fundamentals of advanced semiconductor packaging
  • Explore co-design methodologies for integrated circuits
  • Optimize packaging performance with innovative materials
  • Implement AI-driven solutions in chip packaging design
  • Analyze industry case studies on advanced packaging techniques

    • Framework Connections

    The materials within this course focus on the NICE Framework Task, Knowledge, and Skill statements identified within the indicated NICE Framework component(s):

    Feedback

    If you would like to provide feedback on this course, please e-mail the NICCS team at NICCS@mail.cisa.dhs.gov. Please keep in mind that NICCS does not own this course or accept payment for course entry. If you have questions related to the details of this course, such as cost, prerequisites, how to register, etc., please contact the course training provider directly. You can find course training provider contact information by following the link that says “Visit course page for more information...” on this page.

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